IBE Electronics Co., Ltd

Finish copper: 90UM
Minimum trace width: 8 mil
Minimum hole: 8 mil
Liquid sensitive green solder mask, ...

[Expiration Date: 2010-06-01]

Mobile PCB with BGA
Minimum line space: 0.15mm
Minimum line width: 0.15mm
Thickness: 1.0mm
Copper ...

[Expiration Date: 2010-06-01]

Thickness of the board: 0.6mm
Layer: 4
Minimum hole size: 0.2mm
Gold thickness: 0.035
Solder mask: ...

[Expiration Date: 2010-06-01]

Thickness of the board: 2.0mm
Copper thickness: 2oz
Layer: 8 layer
Thickness of gold: 32u
Solder mask: ...

[Expiration Date: 2010-06-03]

Layers: 4 layers
Material: FR-4
Surface treatment: immersion gold
Minimum drill hole: 0.25
Line ...

[Expiration Date: 2010-06-10]

PCB parameter:
Material: FR4
Layers: 2 L
Surface finishes: Immersion gold
Minimum trace size: ...

[Expiration Date: 2010-06-15]

Immersion gold PCB
Layers: 18
Material: FR4
Finish: Immersion gold
Minimum hold size: 0.2mm ...

[Expiration Date: 2010-06-02]

Parameters:
Layer: 4
Surface treatment: Lead-free HASL
Minimum drill hole: 0.25mm
Line width ...

[Expiration Date: 2010-06-03]

Layer: 2 layer
Materail: FR4
Surface finish: Lead free HASL
Size: 200.5*100mm/1UP
Usage: Controller ...

[Expiration Date: 2010-06-06]

PCB parameters:
Material: FR4
Layers: 4L
Surface finish: Lead free HASL
Usage: Control ...

[Expiration Date: 2010-06-22]

High difficulty PCB
Thickness: 3.0mm
Material: FR4
Finish: immersion gold
Outlined by CNC routing

[Expiration Date: 2010-06-03]

Material: FR4

Layer: 2 layers
Surface finish: Lead free HASL
Minimum holes size: 0.3mm
Minimum ...

[Expiration Date: 2010-06-10]

PCB parameters:
Material: FR4
Layeres: 2 L
Thickness: 1.6+/-10%mm
Surface finish: Lead free HASL ...

[Expiration Date: 2010-06-19]

PCB parameter:
Material: FR4
Layers: 4L
Surface finishes: Lead free HASL
Minimum trace size: ...

[Expiration Date: 2010-06-15]

PCB parameters:
Material: FR4
Layers: 4L
Surface finish: Lead free HASL
Usage: Control board

[Expiration Date: 2010-06-25]

Six layers PCB
Blue solder mask
Thickness: 1.6mm
Outer copper: 1.5 ounces
Surface processing: ...

[Expiration Date: 2010-06-01]

PCB parameters:
Material: FR4
Layers: 8 layers
Surface finishes: Immersion gold
Usage: DVB products

[Expiration Date: 2010-06-15]

Material: FR4
Layer: 1L
Minimum trace size: 0.15mm
Minimum hole size: 0.5 mm
Surface finish: Lead free ...

[Expiration Date: 2010-06-05]

Layer count: 8 layers
Material: FR4
Thickness: 0.8mm
Minimum hold size: 0.1mm
With blind and buried ...

[Expiration Date: 2010-06-01]

Four-layer peelable solder mask PCB:
Material: FR-4
Thickness: 1.6mm
Surface processing: Immersion ...

[Expiration Date: 2010-06-11]

Material: FR4
Layer: 4 layers
Thickness: 1.6mm
Copper weight: 1oz
Surface finishes: Immersion ...

[Expiration Date: 2010-06-11]

Finish: Immersion gold
Layers: 4
Thickness: 0.6mm
Material: FR4
Minimum hole size: 0.1mm
RoHS compliant

[Expiration Date: 2010-06-06]

Material: FR-4
Layer: 2 layers
Surface treatment: Lead-free
Minimum drill hole: 0.25
AOI inspection ...

[Expiration Date: 2010-06-06]

PCB gold finger
Board thickness: 1.6mm
Minimum hole: 0.25mm
Line space/width: 6mil
RoHS ...

[Expiration Date: 2010-06-01]

PCB parameters;
Material: FR4
Thickness: 1.6mm
Surface finishes: Immersion gold
Package: Antistatic ...

[Expiration Date: 2010-08-06]

PCB parameter:
Material: FR4
Layers: 2L
Surface finishes: Lead free HASL
Minimum trace size: ...

[Expiration Date: 2010-06-15]

Material: FR4
Layer: 2
Thickness: 1.6mm
minimum trace size:0.15mm
minimum hole size:0.35mm ...

[Expiration Date: 2010-06-11]

Minimum drill hole: 0.2mm
Line width (minimum): 0.1mm
Line space (minimum): 0.1mm
PCB assembly ...

[Expiration Date: 2010-06-03]